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INTEGRATED CIRCUITS
DATA SHEET
TJA1050 High speed CAN transceiver
Preliminary specification File under Integrated Circuits, IC18 1999 Sep 27
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
FEATURES * Fully compatible with the "ISO 11898" standard * High speed (up to 1 Mbaud) * Transmit Data (TXD) dominant time-out function * Bus lines protected against transients in an automotive environment * Silent mode in which the transmitter is disabled * Differential receiver with wide common-mode range for high ElectroMagnetic Immunity (EMI) * Input levels compatible with 3.3 V devices * Thermally protected * Short-circuit proof to battery and ground * An unpowered node does not disturb the bus lines * At least 110 nodes can be connected. QUICK REFERENCE DATA SYMBOL VCC VCANH VCANL Vi(dif)(bus) tPD(TXD-RXD) Tamb PARAMETER supply voltage DC voltage at CANH DC voltage at CANL differential bus input voltage propagation delay TXD to RXD; see Fig.4 operating ambient temperature dominant VS = 0 V 1.5 - -40 0 < VCC < 5.25 V; no time limit CONDITIONS MIN. 4.75 -27 GENERAL DESCRIPTION
TJA1050
The TJA1050 is the interface between the CAN protocol controller and the physical bus. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. The TJA1050 is the successor to the PCA82C250 high speed CAN transceiver. The most important improvements are: * Much lower ElectroMagnetic Emission (EME) due to optimal matching of the CANH and CANL output signals * Improved behaviour in case of an unpowered node.
MAX. 5.25 +40 3 250 +125
UNIT V V V ns C
ORDERING INFORMATION TYPE NUMBER TJA1050T TJA1050U PACKAGE NAME SO8 - bare die DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm VERSION SOT96-1 -
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
BLOCK DIAGRAM
TJA1050
handbook, full pagewidth
VCC 3 60 A VCC 200 A GND TEMPERATURE PROTECTION
S
8
TXD
1
TXD DOMINANT TIME-OUT TIMER VCC
DRIVER 7 25 k 0.5VCC GND 6
CANH
RXD
4
RECEIVER GND 5 REFERENCE VOLTAGE
25 k CANL
Vref
TJA1050
2
MGS374
GND
Fig.1 Block diagram.
PINNING SYMBOL TXD PIN 1 DESCRIPTION transmit data input; reads in data from the CAN controller to the bus line drivers ground supply voltage receive data output; reads out data from the bus lines to the CAN controller reference voltage output LOW-level CAN bus line HIGH-level CAN bus line select input for high speed mode/silent mode Fig.2 Pin configuration.
handbook, halfpage
GND VCC RXD
2 3 4
TXD 1 GND 2
8S 7 CANH CANL Vref
TJA1050T
VCC RXD 3 4
MGS375
6 5
Vref CANL CANH S
5 6 7 8
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
FUNCTIONAL DESCRIPTION The TJA1050 is the interface between the CAN protocol controller and the physical bus. It is primarily intended for high speed automotive applications using baud rates from 40 kbaud up to 1 Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898" standard. A current-limiting circuit protects the transmitter output stage from damage caused by accidental short-circuit to either positive or negative battery voltage, although power dissipation increases during this fault condition. A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 165 C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when TXD goes HIGH. The thermal protection circuit is particularly needed when a bus line short-circuits. The CANH and CANL lines are protected from automotive electrical transients (according to "ISO 7637"; see Fig.6) and are also protected from Electro-Static-Discharge (ESD) of up to 4 kV from the human body. Table 1 Function table of the CAN transceiver (X = don't care) VCC 4.75 to 5.25 V 4.75 to 5.25 V 4.75 to 5.25 V <2 V (not powered) 2 V < VCC < 4.75 V TXD 0 X 1 (or floating) X >2 V S 0 (or floating) 1 X X X CANH HIGH 0.5 x VCC 0.5 x VCC 0 V TJA1050
Control line S (pin 8) allows two operating modes to be selected; high speed mode or silent mode. High speed mode is the normal operating mode and is selected by connecting pin S to ground. It is the default mode if pin S is unconnected. In the silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC. A `TXD Dominant Time-out' timer circuit prevents the bus lines being driven to a permanent dominant state (blocking all network communication) if TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on TXD. If the duration of the LOW-level on TXD exceeds the internal timer value, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on TXD.
BUS STATE RXD dominant recessive recessive recessive recessive 0 1 1 X X
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are referenced to GND (pin 2). Positive currents flow into the IC. SYMBOL VCC VCANL, VCANH VTXD, VRXD, Vref and VS Vtrt(CANH), Vtrt(CANL) Vesd PARAMETER supply voltage DC voltage at CANL and CANH DC voltage at TXD, RXD, Vref and S transient voltage at CANH and CANL electrostatic discharge at CANH; CANL electrostatic discharge at TXD; VCC; RXD; Vref and S electrostatic discharge at all pins Tstg Tamb Tj Notes 1. The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b, (see Fig.6). 2. In accordance with "IEC 747-1". An alternative definition of Tj is: Tj = Tamb + P x Rth(j-a), where Rth(j-a) is a fixed value to be used for the calculation of Tj. The rating for Tj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). 3. Human body model; C = 100 pF R = 1.5 k. 4. Machine model; C = 200 pF R = 25 . THERMAL CHARACTERISTICS According to IEC 747-1. SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient; TJA1050T(SO8) CONDITIONS in free air VALUE 160 UNIT K/W storage temperature operating ambient temperature junction temperature note 2 time limit is 1 s note 1 note 3 note 3 note 4 0 < VCC < 5.25 V; no time limit CONDITIONS MIN. -0.3 -27 -0.3 -55 -200 -4 -2 -200 -55 -40 -40 MAX. +5.25 +40 V V UNIT
VCC + 0.3 V +55 +200 +4 +2 +200 +150 +125 +150 V V kV kV V C C C
QUALITY SPECIFICATION Quality specification "SNW-FQ-611 part D" is applicable.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
CHARACTERISTICS VCC = 4.75 to 5.25 V; Tamb = -40 to +125 C; RL = 60 unless specified otherwise; all voltages are referenced to GND (pin 2); positive currents flow into the IC; all parameters are guaranteed over the ambient temperature range by design, but only 100% tested at Tamb = 25 C unless specified otherwise. SYMBOL Supply (VCC) ICC supply current dominant; VTXD = 0 V recessive; VTXD = VCC Transmitter data input (TXD) VIH VIL IIH IIL Ci(TXD) VIH VIL IIH IIL IOH IOL Vref Vref VCANH(reces); VCANL(reces) reference output voltage -50 A < IVref < 50 A VTXD = VCC; no load -27 V < VCANH, VCANL < 32 V; 0 V < VCC < 5.25 V VTXD = 0 V 0.45VCC 2.0 -2.5 0.5VCC - - 0.55VCC 3.0 +2.5 V HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current TXD input capacitance output recessive output dominant VTXD = VCC VTXD = 0 V not tested 2.0 -0.3 -30 -100 - 2.0 -0.3 30 -30 tbf 2 - - 0 -200 - - - 60 0 VCC + 0.3 V +0.8 +30 -300 tbf V A A pF tbf tbf - - 75 13 mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Mode select input (S) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current silent mode high speed mode VS = VCC VS = 0 V VRXD = 0.7 VCC VRXD = 0.45 V VCC + 0.3 V +0.8 100 +30 V A A mA mA
Receiver data output (RXD) HIGH-level output current LOW-level output current tbf 8.5 tbf 20
Bus lines (CANH; CANL) recessive bus voltage V mA
Io(CANH)(reces); recessive output current Io(CANL)(reces) Vo(CANH) Vo(CANL) Vi(dif)(bus) CANH dominant output voltage CANL dominant output voltage differential bus input voltage (VCANH - VCANL)
2.8 0.5
- - -
4.5 2.0 3.0
V V V
VTXD = 0 V; 42.5 < RL < 60 (dominant) VTXD = VCC; no load (recessive)
1.5
-500 -35 35
- - -
+50 -95 150
mV mA mA
Io(sc)(CANH) Io(sc)(CANL)
CANH short-circuit output current CANL short-circuit output current
VCANH = 0 V; VTXD = 0 V VCANL = 36 V; VTXD = 0 V 6
1999 Sep 27
Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
SYMBOL Vdif(th) Vi(dif)(hys) Ri(cm)(CANH); Ri(cm)(CANL) Ri(cm)(m)
PARAMETER
CONDITIONS
MIN.
TYP. 0.7 - 25 -
MAX. 0.9 200 50 +3 V
UNIT
differential receiver threshold -12 V < VCANH, 0.5 voltage VCANL < 12 V; see Fig.5 differential receiver input voltage hysteresis CANH; CANL common mode input resistance matching between CANH and CANL common mode input resistance differential input resistance CANH; CANL input capacitance differential input capacitance CANH; CANL input leakage current VCC = 0 V; VCANH = VCANL = 5 V VTXD = VCC; not tested VCANH = VCANL see Fig.5 100 10 -3
mV k %
Ri(dif) Ci(CANH); Ci(CANL) Ci(dif) ILI(CANH); ILI(CANL) Tj(sd)
20 - - -
50 - - -
100 20 10 500
k pF pF A
Thermal shutdown shutdown junction temperature 155 165 180 C
Timing characteristics (see Figs 3 and 4) td(TXD-BUSon) td(TXD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) delay TXD to bus active delay TXD to bus inactive delay bus active to RXD delay bus inactive to RXD tbf tbf 100 ns VS = 0 V tbf tbf 150 ns
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TEST AND APPLICATION INFORMATION
TJA1050
+5 V handbook, halfpage 47 F 100 nF VCC TXD Vref 3 1 7 CANH RL 60 6 2 15 pF GND 8 S CANL CL 100 pF
5
TJA1050
RXD
4
MGS376
Fig.3 Test circuit for timing characteristics.
handbook, full pagewidth
HIGH TXD LOW
CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD t d(TXD-BUSon) t d(BUSon - RXD) t PD(TXD - RXD) t PD(TXD - RXD) 0.3VCC 0.7VCC LOW t d(TXD-BUSoff) t d(BUSoff - RXD)
MGS377
(1) Vi(dif)(bus) = VCANH - VCANL
Fig.4 Timing diagram for AC characteristics.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
MGS378
VRXD HIGH
LOW hysteresis 0.5 0.9
Vi(dif)(bus)
Fig.5 Hysteresis of the receiver.
handbook, full pagewidth
+5 V 47 F 100 nF VCC TXD Vref 3 1 7 CANH 1 nF
5
TJA1050
6 2 8 GND S CANL 1 nF
TRANSIENT GENERATOR
RXD
4
MGS379
15 pF
The waveforms of the applied transients shall be in accordance with "ISO 7637 part 1", test pulses 1, 2, 3a and 3b.
Fig.6 Test circuit for automotive transients.
1999 Sep 27
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
TJA1050
handbook, full pagewidth
+5 V 47 F 100 nF VCC TX0 TXD Vref 3 1 7 CANH
120
SJA1000
CAN CONTROLLER RX0
5
TJA1050
6 CANL
CAN BUS LINE
RXD
4 2 GND 8 S 120
MGS380
Fig.7 Application information.
BONDING PAD LOCATIONS FOR TJA1050U
Table 2 Bonding pad locations All x/y coordinates represent the position of the centre of each pad (in m) with respect to x/y = 0 of the die (see Fig.8). COORDINATES SYMBOL PAD x y 103 85 111 111 1094 1111 1111 1097 1 2 3 4 5 6 7 8 103 740.5 886.5 1371.5 1394 1006 542.5 103
handbook, halfpage
8
7
6
5
TXD GND VCC RXD
test pad
TJA1050U
Vref CANL CANH
x 0 0 y
1
23
4
MGS381
S
Fig.8 Bonding pad locations.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm
TJA1050
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-05-22
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
TJA1050
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable suitable(2) recommended(3)(4) recommended(5) suitable not not suitable suitable suitable suitable suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not
TJA1050
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TJA1050
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
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Philips Semiconductors
Preliminary specification
High speed CAN transceiver
NOTES
TJA1050
1999 Sep 27
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Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
285002/01/pp16
Date of release: 1999
Sep 27
Document order number:
9397 750 05732

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